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SOURCE Adeneo Embedded
NUREMBERG, Germany, Feb. 25, 2014 /PRNewswire/ -- Adeneo Embedded today announced the release of Windows Embedded Compact 2013 BSP solution for Sitara™ AM335x development platforms from Texas Instruments (TI). The WEC2013 BSP supports the latest AM335x Starter Kit as well as the AM335x evaluation module. Along with this release, Adeneo Embedded has also made available upgraded versions of their existing WEC7 BSPs for the AM335x platforms. These latest BSPs from Adeneo provide a fully validated and robust solution for the AM335x platforms while also including improved documentation and packaging of the BSP.
TI's Sitara AM335x processor, based on an ARM® Cortex®-A8 core, is designed with the right set of highly integrated peripherals and low-power architecture. Delivering up to 1 GHz of performance with support for graphics and industrial protocol IPs, TI's AM335x processor is a perfect product for developing home/industrial automation, medical devices and enterprise tablet solutions.
The new Windows Embedded Compact 2013 operating system from Microsoft is a streamlined version of its predecessor Windows Embedded Compact 7. WEC2013 provides many new features along with better network performance, optimized kernel, support for the latest ARM compilers and the latest toolset VS2012.
Adeneo Embedded, a TI Design Network Platinum Member and a Microsoft Gold Partner, has been developing Windows Embedded Compact BSPs on TI platforms for several years. Adeneo Embedded is the official OS and SW support partner of TI for the Sitara AM335x platform. "The WEC offering from Adeneo on the AM335x platforms is our commitment as a system integrator and partner to bring the latest in technology to our customers in multiple embedded market segments including medical and industrial. Strong partnerships with Microsoft and TI has enabled us to bring such solutions to the market on time while also letting continuously improve these solutions with releases of upgraded versions which are more robust and are of better quality," said Yannick Chammings, CEO of Adeneo Embedded.
TI is committed to delivering best-in-class products to the embedded market while maintaining a strong ecosystem of partners through the Design Network program to enable these customers on various complementary technologies. "Adeneo Embedded has been a strong collaborator, offering various software and support services on TI products. With their latest Windows Embedded Compact offering on the Sitara AM335x development platforms, Adeneo has proven again its capability to provide our customers with solutions that help them build next-generation products using the latest Windows Embedded technologies," said Alejandro Erives, Sitara Processors brand manager, TI.
For complete information and feature set details on the WEC 7/2013 BSPs from Adeneo Embedded for TI's Sitara AM335x platforms, please refer to http://www.adeneo-embedded.com/Products/Board-Support-Packages/Texas-Instruments-Sitara
About Adeneo Embedded
Adeneo Embedded provides system integration, design, support and training services to companies seeking world-class expertise in embedded solutions using high-performance architectures. For over 10 years, Adeneo Embedded has helped clients, in all stages of development; create profitable, feature-rich products that incorporate software and hardware solutions based on Windows Embedded operating systems as well as Silverlight and .Net technologies. Close working partnerships with industry-leading silicon and Microsoft allow Adeneo Embedded to apply its experience to a wide range of embedded solutions for the automotive, industrial, medical, multi-media, navigation, networking, mobile and wireless markets. Adeneo Embedded has a global sales and support network backed by engineering offices in North America and Europe.
About the Texas Instruments Design Network
Adeneo Embedded is a platinum member of the TI Design Network, a premier group of independent, well-established companies that offer products and system-level design and manufacturing services complementing TI's semiconductors to a worldwide customer base to accelerate product innovation and time-to-market. Network members provide product design, hardware and software system integration, turnkey product design, RF and processor system modules, reference platforms, software development, proof-of-concept design, feasibility studies, research, certification compliance, prototyping, manufacturing, and product life cycle management. For more information about the TI Design Network, please visit http://www.ti.com/designnetwork.
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